An interesting challenge for power semiconductor manufacturers is the difficulty of developing technology-specific design tools, manufacturing tools, and packaging, test, and assembly capabilities for each technology. For instance, SiC wafers need to be etched, doped, and thinned differently from silicon chips.16
With so much technology and tools to be developed, it’s not surprising that a lot of money has been pumped in to manufacture and develop these highly specialized chips. In China, three major SiC manufacturers have earmarked a total of US$4 billion in capital expenditures (capex) for this purpose during 2022 and beyond.17 Moreover, the country continues to see large rounds of PE and VC funding for SiC-based start-ups (estimated at US$1.5 billion total in June 2022 alone).18 In 2021, China even witnessed the first SiC IPO of more than US$300 million, as well as another filed by a substrate producer.19
It’s not just China, either. SiC and GaN makers in the US, Europe, Japan, and South Korea committed to making at least US$10 billion in total capex in 2022.20 A GaN company in Canada raised almost C$200 million from VCs, a US GaN company went public via SPAC for over US$1 billion, and a big French SiC company bought a smaller French SiC company late in 2021.21
Neither SiC nor GaN are expected to replace silicon in the trillions of chips for which silicon is now, and will likely always be, superior. But although they will remain niche, power semiconductors’ advantages in withstanding high voltages—and the need for more of the products they support—mean that this is one niche market that’s likely to grow significantly faster than the silicon chip mainstream.